Reducing Material Waste Using Six Sigma in Printed Circuit Board Assembly

PROCEEDINGS ARTICLE published 1 January 2007 in Volume 3: Design and Manufacturing

Authors: Naji E. Gebara | Badih Jawad

Study of Printed Circuit Board Shock Transmissibility

PROCEEDINGS ARTICLE published 1 January 2007 in ASME 2007 InterPACK Conference, Volume 2

Authors: Frank Fan Wang

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

PROCEEDINGS ARTICLE published 1 January 2007 in ASME 2007 InterPACK Conference, Volume 2

Authors: Wataru Nakayama | Tatsuya Nakajima | Hiroko Koike | Ryuichi Matsuki

Ant colony algorithms for the travelling salesman problem and the quadratic assignment problem

BOOK CHAPTER published 28 September 2018 in Swarm Intelligence - Volume 1: Principles, current algorithms and methods

Authors: Nikola Ivkovic

The Network Locating Principle in Flexible Circuit Board Assembly

PROCEEDINGS ARTICLE published 1 January 2009 in Volume 5: Electronics and Photonics

Authors: Ruijun Chen

Nonlinear Response of a Printed Circuit Board in Shock

PROCEEDINGS ARTICLE published 1 January 2009 in ASME 2009 InterPACK Conference, Volume 2

Authors: M. Vujosevic | P. Raghavan | G. Ramanathan | W. Hezeltine | K. Blue

An Experimental Investigation of the Thermal Interaction of Electro-Optical Components on a Printed Circuit Board in Natural and Forced Convection

PROCEEDINGS ARTICLE published 1 January 2003 in Heat Transfer: Volume 3

Authors: Amy S. Fleischer | Randy D. Weinstein

Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger

PROCEEDINGS ARTICLE published 1 January 2005 in Heat Transfer: Volume 2

Authors: J. Wu | M. M. Ohadi | S. Dessiatoun | J. Qi

Studies on the Dynamic Behavior of a Printed Circuit Board

PROCEEDINGS ARTICLE published 12 September 1999 in Volume 7A: 17th Biennial Conference on Mechanical Vibration and Noise

Authors: Hongfang Wang | Mei Zhao

Novel Design Concept of Planar Litz Winding Without Via Using Folded Printed Circuit Board

PROCEEDINGS ARTICLE published 4 August 2013 in Volume 6B: 37th Mechanisms and Robotics Conference

Authors: T. Nomura | K. Seto | K. Toshiyuki

Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge

PROCEEDINGS ARTICLE published 1 January 2007 in ASME 2007 InterPACK Conference, Volume 2

Authors: Wataru Nakayama | Tatsuya Nakajima | Hiroko Koike | Ryuichi Matsuki

Chapitre I

BOOK CHAPTER published in Recueil des Cours, Collected Courses, Volume 88 (2007)

Reliability Assessment for Printed Circuit Board in Lead-Free Process

PROCEEDINGS ARTICLE published 1 January 2009 in ASME 2009 InterPACK Conference, Volume 1

Authors: Chien-Yi Huang | Chen-Liang Ku | Hao-Chun Hsieh | Tzu-Min Chien | Hui-Hua Huang

CAM System Based on Constant Drill Hole Temperature for Drilling in Printed Wiring Board

PROCEEDINGS ARTICLE published 1 January 2007 in ASME 2007 InterPACK Conference, Volume 1

Authors: Toshiki Hirogaki | Eiichi Aoyama | Keiji Ogawa | Seita Sumida

An Object-Oriented Knowledge-Based System for Assembly of Printed Circuit Boards

PROCEEDINGS ARTICLE published 22 September 1991 in 17th Design Automation Conference: Volume 1 — Design Automation and Design Optimization

Authors: Sisir K. Padhy | S. N. Dwivedi

Bilan et perspectives

BOOK CHAPTER published in Recueil des Cours, Collected Courses, Volume 141 (2007)

PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux

PROCEEDINGS ARTICLE published 1 January 2007 in Volume 5: Electronics and Photonics

Authors: Shantanu Mukherjee | Manuel Castro | Pei-Fang Jennifer Tsai | Krishnaswami Srihari | Van D. Nguyen

Effects of Boundary Conditions and Source Dimensions on the Effective Thermal Conductivity of a Printed Circuit Board

PROCEEDINGS ARTICLE published 1 January 2003 in 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2

Authors: Younes Shabany

Millimeter-wave antennas using printed-circuit-board and plated-through-hole technologies

BOOK CHAPTER published 28 November 2018 in Developments in Antenna Analysis and Design: Volume 2

Solving the Meeting Conflict Problem

DATASET published 20 January 2020 in Volume 34, Number 4, August 2007